COMPONENT PACKAGES
USON Component Package
| Date Published: | |
| Last Modified: |
Overview
| Name | USON (Plastic Ultra-Thin Small Outline No-lead Package, JEDEC) |
| Synonyms |
|
| Variants | Varying number of pins. |
| Similar To | WSON |
| Mounting | SMD |
| Pin Count | 4 - 16 |
| Pitch | 0.5mm, 0.65mm (DNP, TI), 1.0mm (NLB, TI) |
| Solderability | Hard to solder with a soldering iron due to underside thermal pad. |
| Thermal Resistance | |
| Dimensions | |
| 3D Models | |
| Common Uses |
The [http://www.ti.com/packaging/docs/searchtipackages.tsp?packageName=SON](Texas Instruments Package Search - SON) page contains information on all of the USON packages that TI components use.
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